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AMSEMI ATW200proFully Automatic Wafer Taper
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    ATW200pro Fully Automatic Wafer Taper Features


    Advanced ESD roller taping(roller heater as options)

    Fully automatic tape feeding & inner Pre-cutting

    Configure with multi link wafer transfer robot(Vacuum or Bernoulli arm)

    Wafer position & warpage intelligent mapping

    Fiber sensor for wafer pre-alignment

    CCD for pre-cutted tape alignment

    ESD Teflon plating chuck to handle various wafer (chuck heater optional)

    Wafer cassette loading & Unloading(Wafer Box as options)

    Standard industrial PC control with 17” touch panel LCD

    Built-in Ionizers for ESD protection

    Lower tension control technology for taping process



    ATW200pro Fully Automatic Wafer Taper Specifications 


    Wafer Size

    Diameter:4”, 5”, 6”& 8”

    Thickness:50 ~ 725 um(Upgrade to handle thinner wafer capability)

    Wafer Type

    Si , GaAs   Single Flat, Double Flat or V-Notch

    Tape Type

    Blue Tape or UV Tape  or Lamination Tape  etc.

    Width: 120 ~ 240 mm, Length: 100m, Thickness: 0.03 ~ 0.2 mm

    Taping Chuck Temp.

    Room Temp. ~ 100℃ Controllable (Optional)

    Pre-Cutting System

    Multi-Axis Fine Precision Profile Cutter 

    Wafer Place Accuracy

    X-Y: +/- 0.1 mm,  Θ : +/- 0.25°

    Input & Output

    Single Input Wafer Cassette / Wafer Box(Optional)

    Single Output Wafer Cassette /  Wafer Box(Optional)

    Customer Specified(Sample Supply)

    ESD Control

    Teflon Plating Wafer Chuck /ESD Blower

    Wafer Transfer

    Horizontal Multi-link  Robot with Bernoulli or Vacuum Effect Hand

    Wafer Position & Warpage Intelligent Mapping in Cassette

    Alignment

    Fiber Sensor  Non-contact alignment 

    CCD for Pre-cutted tape fine alignment

    Control Unit

    Standard Industrial PC with 17” Touch Panel LCD

    Windows 7/10   Professional O/S

    Power Supplier

    Single Phase AC 220 V, 16A

    Air Supplier

    60 PSI CDA , 2.5 CFM


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