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AMSEMI ATW200Fully Automatic Wafer Taper
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    ATW200 Fully Automatic Wafer Taper Features


    Advanced ESD roller taping 

    Fully automatic tape feeding & mounting

    Configure with multi-link wafer transfer robot with vacuum fork 

    Wafer position & warpage intelligent mapping

    Fiber sensor for wafer alignment

    Heating ESD contact wafer chuck to handle various wafers (Optional)

    Wafer cassette loading & unloading 

    Standard industrial PC control with 15” touch panel LCD

    Made of full aluminium profiles frame 

    Built-in Ion Blower for ESD protection

    Lower tension control technology



    ATW200 Fully Automatic Wafer Taper Specifications 


    Wafer Size

    Diameter:4”, 5”, 6”& 8”

    Thickness:300 ~ 725 um

    Wafer Type

    Si , GaAs Single Flat, Double Flat or V-Notch

    Tape Type

    Blue Tape or UV Tape 

    Width:120 ~ 240 mm

    Length:100 m

    Thickness:0.03 ~ 0.2 mm

    Taping Temp.

    Room Temp. ~ 100 °C Controllable (Optional)

    Cutting System

    Multi-Axis Fine Precision Profile Cutter;  edge cutter heater, up to 120℃

    Wafer Place Accuracy

    X-Y: +/- 0.2 mm   Θ : +/- 0.5°

    Input & Output

    Single Input Wafer Cassette / Single Output Wafer Cassette 

    Customer Specified (Sample Supply)

    ESD Control

    Ion Blower

    Wafer Transfer

    Horizontal Multi-link Robot with Vacuum fork  transfer wafer

    Wafer Position & Warpage Intelligent Mapping in Cassette

    Alignment

    Fiber Sensor Non-contact Alignment

    Control Unit

    Standard Industrial PC with 15” Touch Panel LCD, Windows7/10 Pro  O/S

    Power Supplier

    Single Phase AC 220 V, 16A

    Air Supplier

    60 PSI CDA , 2.5 CFM

    Conversion Time

    <=  15 Minutes

    Dimensions

    1300 mm (W) ×1500mm(D) ×1750mm(H)

    Machine Construction

    Made of Full Aluminium Profile

    Net Weight

    600 Kg around

    (Specifications items update without notice)


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